High-purity and even ultra-high-purity metal materials are the basis of producing high-purity sputtering target materials. Taking sputtering target materials for semiconductor chips as an example, if the impurity content of sputtering target materials is too high, the film formed can not meet the required electrical properties, and particles are easily formed on the wafer during sputtering process, resulting in short circuit or damage, seriously affecting the performance of the film.Usually, the purification of high purity metals is divided into chemical and physical purification. In order to obtain higher purity metal materials and remove impurities to the greatest extent, it is necessary to combine chemical and physical purification. After the metal is purified to a fairly high purity, it often needs to be proportioned with other metal elements before it can be put into use. In this process, it needs to go through smelting, alloying and casting steps: by refining high purity metal, removing excess gases such as oxygen and nitrogen; adding a small amount of alloy elements to make it fully combined with high purity metal and evenly distributed; and finally casting it into non-pure metal. The defective ingot meets the requirements of metal composition and size in production and processing.

   In the manufacturing process of sputtering target, firstly, process design should be carried out according to the performance requirements of downstream application fields, then repeated plastic deformation and heat treatment should be carried out. Key indexes such as grain size and orientation should be precisely controlled, and then welding, mechanical processing, cleaning and drying, vacuum packaging and other processes should be carried out. The process involved in sputtering target manufacturing is fine and varied. The process management and manufacturing technology level will directly affect the quality and quality of sputtering target.

Sputtering coating refers to the process in which an object is sputtered when it is impacted by ions, and is made by attaching the sputtered object to the target substrate. Sputtering target is the target material bombarded by high-speed charged particles. This link is the most demanding link in the sputtering target industry chain for production equipment and technology. The quality of sputtering film has an important impact on the quality of downstream products.

    In the process of sputtering coating, sputtering target materials need to be installed in the machine to complete sputtering reaction. The machine has strong specificity and high precision. The market has long been monopolized by American and Japanese multinational groups. The main equipment suppliers include AMAT (USA), ULVAC (Japan), ANELVA (Japan), Varian (USA), ULVAC (Japan) and other well-known enterprises in the industry.