A preparation method of high pure tantalum target, including: forging high pure tantalum ingot and then conducting first heat treatment, the first heat treatment temperature is 1290 to 1350 C, and the forged and first heat treatment is three times in turn; after the last first heat treatment, the tantalum ingot is preheated, and then the calendering is carried out. The post tantalum ingot is treated with second heat. The technology of making tantalum target material can ensure better uniformity and compactness of tantalum target material, which meets the grain requirements and crystal direction requirements of tantalum target materials for semiconductor sputtering.
Tantalum is a rare high melting point metal. The melting point is 2996 C, the density is 16.68g/cm3, and the lattice type is BCC.Thermal conductivity: (25°C) 54W/M·K. Linear expansion coefficient :(0~100°C) 6.5×10-6.Tantalum is mainly used for making tantalum electrolytic capacitors,Tantalum Alloys, such as Ta - 2.5W, Ta - 10W, Ta - 40Nb and so on, are more able to withstand the corrosion of high temperature and mineral acid than any other material, and can be used as heat-resistant high strength materials for aircraft, missiles and rockets, as well as parts of control and regulation devices.
Tantalum can be used as supporting accessories, heat shield, heater and heat sink in high temperature vacuum furnace. Tantalum canoe can be used in vacuum steaming device. Tantalum and human tissues have excellent biological compatibility and stability. It can not react to human tissues and can be used as surgical materials such as plate screws and stitches.
Tantalum target material: melting point: 2996 C, density: 16.68g/cm3, thermal conductivity (25 C): 54 (W/M.K).Tantalum targets are usually prepared by smelting tantalum ingot or by powder metallurgy process.
The purity of tantalum target is more than 99.95%, the surface is smooth, the grain diameter is less than 100 m, and the texture of grain is mainly the texture of [111].As tantalum has high conductivity, high thermal stability and blocking effect on the foreign atoms, the tantalum film is coated on the integrated circuit by the method of base emitter coating, which prevents the copper from spreading to the matrix silicon. As an electrode material and surface engineering material (BM), tantalum target has been widely used in liquid crystal display (LCD), and in heat-resistant and anticorrosive high conductivity coating industry.
The tantalum target of BaoJi Yuan Da Metal Materials Co., Ltd is produced by EB electron bombardment. The tantalum ingot is produced by rolling and annealing process. The target material produced by this method has good internal structure, uniform crystal structure, texture and energy distribution. At present, products are exported to Japan, Korea, Taiwan, the United States and other countries and regions.
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